High-Speed Backplanes
Multilayer interconnects with routing and via-management requirements.
The pioneer of industrial revolution
The pioneer of industrial revolution
Your signal requirements come first. Manufacturing feasibility follows.
High-speed digital and high-frequency RF PCBs require more than a capable fabrication process. Material properties, stack-up geometry, impedance tolerances, and via structures all influence whether a design can be built consistently and economically.
AUSPI supports OEM and EMS customers with PCB manufacturing solutions for high-speed multilayer and RF/microwave applications. We help assess specified materials, fabrication requirements, and prototype-to-production feasibility against available manufacturing capabilities—so discussions begin with your design, not with an exaggerated list of maximum specifications.
High-speed digital and RF/microwave boards have different manufacturing priorities. Start with the track that matches your design.
For demanding digital interconnections where signal integrity matters.
High-speed digital boards are used where signal integrity is a key requirement, including server hardware, AI/PCIe systems, high-speed backplanes, and automated test equipment. The PCB manufacturing discussion typically centers on dielectric loss, impedance consistency, fine-line routing, via structures, and backdrill requirements.
Multilayer interconnects with routing and via-management requirements.
High-density digital connections where material and impedance choices matter.
Complex interconnect and layer-stack requirements.
Compact signal distribution and dense routing.
Specialized interconnects for automated test equipment.
The following data reflects the high-speed PCB capability chart provided by AUSPI. Prototype and volume production are shown separately to avoid implying that an engineering-sample limit is a routine mass-production specification.
These figures are individual limits in the high-speed PCB reference chart, not a guarantee that all can be combined in one stack-up. Capability depends on laminate selection, board thickness, copper weight, dimensions, design rules, manufacturing location, and qualification. RF board capabilities should be reviewed separately rather than inferred from this high-speed table.
AUSPI's high-speed material reference covers multiple loss categories, from mid- and low-loss laminates through ultra-low and extremely-low-loss families.
The appropriate laminate depends on the electrical requirements, proposed stack-up, availability, manufacturability and program cost. Please share the specified grade or electrical requirements for a project-specific assessment.
A lower-loss grade is not automatically the best commercial choice for every PCB.Reference laminate grades by dielectric loss (Df) and charted data-rate category.
Data Transfer Rate
RedIn certificationBlueMain promotional materialUnderlinedUL-certified materials
Material and Manufacturing Considerations for RF Applications
RF/microwave boards have different manufacturing priorities. Electrical behavior depends on the chosen dielectric, copper and trace geometry, stack-up, and dimensional consistency at the intended operating frequency. Material selection and fabrication rules must therefore be evaluated together.
RF antenna and signal-distribution structures for wireless communications.
RF circuit boards for communication amplifier applications.
RF and antenna structures with demanding dielectric and dimensional requirements.
PCB applications involving 24 GHz and 60 GHz radar systems.
PCB applications involving 24 GHz and 77 GHz automotive radar systems.
Application categories describe the scope of the reference portfolio; feasibility, validation and qualification for a particular frequency or product must be confirmed for each design.
The high-frequency material list identifies the following families for project assessment:
Material availability, exact grade nomenclature, site-specific processing capability, and certification status require confirmation during quotation. This list is not a claim that every grade is stocked, qualified, or interchangeable.
This is an engineering and manufacturing-feasibility discussion. Where required, final electrical verification or specialized RF qualification should be agreed in the project specification rather than assumed from general capability data.
Confirm the specified laminate, dielectric construction, material availability and any fabrication limitations that affect the requested stack-up.
Review controlled-impedance targets, line/space rules, drill and via details, and backdrilling requirements where applicable.
Assess sample feasibility and volume-production expectations separately. A prototype-only capability should never be presented as a routine production capability.
Coordinate feasibility against the appropriate PCB manufacturing resources, order quantities and delivery requirements.
A useful high-speed or RF PCB quotation starts with the actual constraints.
Send us your PCB fabrication drawing and Gerber/ODB++ data, preferred laminate or Dk/Df targets, layer stack-up, controlled-impedance table, operating frequency or interface requirements, board dimensions, quantities, and any specific backdrilling, testing or qualification needs.
We will review the requirements and discuss the most suitable manufacturing path before confirming what can be quoted and delivered.
High-speed digital PCBs are evaluated around signal integrity at fast data transitions and data rates. RF/microwave PCBs place particular emphasis on material dielectric properties and transmission-line geometry at the operating frequency. Some designs combine both types of requirements.
Yes. The provided capability chart separately identifies engineering-sample and mass-production limits, including up to 42 layers for volume production and up to 62 layers for samples. The applicability of these limits to a specific design is confirmed during engineering review.
The RF material reference lists Rogers, Arlon, Taconic, Wangling and Shengyi families. Exact grade sourcing, manufacturing suitability and qualification must be checked for the specific stack-up and manufacturing route.
Automotive 24 GHz / 77 GHz radar is included among the applications listed in AUSPI's reference portfolio. Feasibility, dielectric construction, process tolerances, testing and industry qualifications are assessed on a project-by-project basis; the application listing is not a blanket performance guarantee.