AUSPI

The pioneer of industrial revolution

Rigid PCB – Process & Control Point

E1

LAMINATE SHEAR

Auto material cutting machine, cut sheet size 37*49inch, 41*49inch, 43*49inch to working PNL size.

Check point:

  1. Base Material Type
  2. Dimension
  3. No Dent、No Scratch
  4. Quantity

INNERLAYER IMAGE

Laser direct imaging

Check point:
1.Correct CAM data

Auto exposure machine

Check point:
1.Energy
2.Vacuity
3.Environment

Develop

check point:
1.Temperature
2.Pressure
3.Concentration

E2 01
E2 02
E11

I/L ETCHING

After development, the non-product copper is etched away.

Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space

AOI INSPECTION

AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue

E2 03
E2 05
E2 06
E2 04

LAMINATION

Horizontal black oxidation
Check point: 1.Concentration 2.Temperature 3.Coating Thinkness

Vertical black oxidation
Check point: 1.Concentration 2.Etching Rate 3.Temperature

Vacuum high-presure laminated machine
Check point: 1.Temperature 2.Temp. increase Rate 3. Pressure
Quality check point: 1.Board Thinkness 2.Delamination 3.Appearance

DRILLING

Mechanical drilling
Check point:
1.Hole Size
2.Hole Wall Roughness
3.Registration
4.The amount of holes
5.Appearance

Laser drilling, drill micro via holes
Check point:
1.Laser drill completely
2.Hole diameter
3.Hole shape

E5
E3
E11

I/L ETCHING

After development, the non-product copper is etched away.

Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space

DRILLING

Mechanical drilling
Check point:
1.Hole Size
2.Hole Wall Roughness
3.Registration
4.The amount of holes
5.Appearance

Laser drilling, drill micro via holes
Check point:
1.Laser drill completely
2.Hole diameter
3.Hole shape

E5
E3
E11

I/L ETCHING

After development, the non-product copper is etched away.

Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space

DRILLING

Mechanical drilling
Check point:
1.Hole Size
2.Hole Wall Roughness
3.Registration
4.The amount of holes
5.Appearance

Laser drilling, drill micro via holes
Check point:
1.Laser drill completely
2.Hole diameter
3.Hole shape

E5
E3
E4
E10

P.T.H.

Plasma desmer
Check point:
1.Plasma parameters
2.Mixed gas species
3.Power energy
4.Working pressure, processing time and gas flow rate

Plate through holes
Check point:
1.Temperature
2.Concentration
3.Plating Rate
4.Back Light Test

PANEL PLATING

Horizontal plating
Check point:
1.Temperature
2.Concentration
3.Current Density

Vertical plating
Check point:
1.Temperature
2.Concentration
3.Current Density

E6
E7
E2 02
E2 01

OUTERLAYER IMAGE

laser direct imaging
Check point:
1.Correct CAM data

Auto exposure machine
Check point:
1.Energy
2.Vacuity
3.Environment

PATTERN PLATING

Pattern plating
Check point:
1.Temperature
2.Concentration
3.Current Density
4.Check scratching the tin on the lines
Quality check point:
1.Hole Wall Thk.
2.Surface Copper Thk.
3.Apperance

E14
E13

O/L ETCHING

The non-product copper is etched away.
Check point:
1.Temperature
2.Speed
3.Pressure
3.Concentration
4.Line width/space

INSPECTION

AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue

E2 03
E9 01

LIQUID S/M

Spry coating line
Check point:
1.No Exposure copper
2.No Mask on Pad
3.No Scratch, Scum

SCREEN LEGEND

Auto-printing
Check point:
1.correct CAM data
2.Registration
3.Definition
4.No scratching

 

E15
E9 02
E17

Immersion gold

Immersion Gold
Check point:
1.Temperature
2.Concentration


Quality check point:
1.Au / Ni thickness
2.Phosphorus percent
3.Apperance

Hot air leveling
Check point:
1.Angle of Air Knives
2.Solder Bath Temp.
3.Air Knives Temp.
Quality check point:
1.Sn/Pb Thinkness
2.Apperance

FINAL SHAPING

CNC routing for finish board size
Check point:
1.Dimension
2.No Powder Residue
3.No Scratch

E9 03
E9 05

ELECTRICAL TEST

Flying probe tester
Check point:
1.Open
2.Short
3.Circumferential Separation

VISUAL INSPECTION

Fanal quality control, visual inspection
Check point:
1.Scratching
2.Crease 3.Oxidation
4.Solder deviation
5.Drill deviation
6.Conductor nick
7.Copper residue and so on

E16
E12 06
E12 05
E12 04
E12 03

O.Q.C

SIR Oven
Surface insulation resistance testing

Thermal cycling chamber
Thermal cycling testing

3D Dimension

X-ray measuring instrument Measuing gold thickness, nickel thickenss, solder thickness and so on

OUR PARTNERS

HOW AUSPI HELP YOU ?

With over 19 years of experience, Auspi has been one of the most successful in satisfying our clients across industries. With facilities in both Europe and Asia, we can satisfy both your geographical and cost requirements. And we always tread a fine line between the quality and the cost. We strive to make every penny of yours counts for the quality! Also, in today’s constantly changing and competitive environment of the electronics industry, there are always news products & services coming in to the market. We make ourselves constantly competitive by extending our service offerings for our clients, out most valuable partners!

Quality, Service and Expertise
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Prototype to Mass Production
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