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Flex PCB / Flexible PCB

Flexible circuit board, also known as flex circuit board, is a special type of printed circuit board where the board has at least a portion which is bendable. Typical use case of flex circuits is referred to as FFC (flexible flat cable) and is used as replacement of cable wires and connectors, in which case the flex circuit is designed without electronic components. Other common use includes components assembled on the flex circuit such as led strip and LCD panel interface.

The electronic circuit is designed on flexible plastic substrate, usually polyimide film for its high heat resistance which makes is suitable for solder mounting components. In some cases polyester film may used as substrate material, where heat resistance is not needed and no components are soldered on the board. Instead, the board is printed with an industrial printer capable of dispensing conductive ink such as silver ink or carbon ink onto the polyester substrate. Examples of use are touch sensors in computer keyboards for key press detection.


Flex circuits are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring. A common application of flex circuits is in computer keyboards; most keyboards use flex circuits for the switch matrix.

In LCD fabrication, glass is used as a substrate. If thin flexible plastic or metal foil is used as the substrate instead, the entire system can be flexible, as the film deposited on top of the substrate is usually very thin, on the order of a few micrometres. Our FPC capabilities.

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Sort Item Normal capability Specific capability
Layer count Rigid-flex PCB 2 ~14 2 ~24
Flex PCB 1 ~10 1 ~12
Board Min. Thickness 0.08 +/- 0.03mm 0.05 +/- 0.03mm
Max. Thickness 6mm 8mm
Max. Size 485mm * 1000mm 485mm * 1500mm
Hole & Slot Min.Hole 0.15mm 0.05mm
Min.Slot Hole 0.6mm 0.5mm
Aspect Ratio 10:01 12:01
Trace Min.Width / Space 0.05 / 0.05mm 0.025 / 0.025mm
Tolerance Trace W / S ± 0.03mm (W/S≥0.3mm:±10%) ± 0.02mm (W/S≥0.2mm:±10%)
Hole to hole ± 0.075mm ± 0.05mm
Hole Dimension ± 0.075mm ± 0.05mm
Impedance 0 ≤ Value ≤ 50Ω : ± 5Ω    50Ω ≤ Value : ± 10%Ω
Material Basefilm Specification PI : 3mil 2mil 1mil 0.8mil 0.5mil
ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ
Basefilm Main supplier Shengyi / Taiflex / Dupont / Doosan / Thinflex
Coverlay Specification PI : 2mil 1mil 0.5mil
LPI Color Green / Yellow / White / Black / Blue / Red
PI Stiffener T : 25um ~250um
FR4 Stiffener T : 100um ~2000um
SUS Stiffener T : 100um ~400um
AL Stiffener T : 100um ~1600um
Tape 3M / Tesa / Nitto
EMI shielding Silver film / Copper / Silver ink
Surface finish OSP 0.1 - 0.3um
HASL Sn : 5um - 40um
HASL(Leed free) Sn : 5um - 40um
ENEPIG Ni : 1.0 - 6.0um
Ba : 0.015-0.10um
Au : 0.015 - 0.10um
Plating hard gold Ni : 1.0 - 6.0um
Au : 0.02um - 1um
Flash gold Ni : 1.0 - 6.0um
Au : 0.02um - 0.1um
ENIG Ni : 1.0 - 6.0um
Au : 0.015um - 0.10um
Immesion silver Ag : 0.1 - 0.3um
Plating Tin Sn : 5um - 35um
SMT Type 0.3mm pitch Connectors
0.4mm pitch BGA / QFP / QFN
0201 Component
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With over 19 years of experience, Auspi has been one of the most successful in satisfying our clients across industries. With facilities in both Europe and Asia, we can satisfy both your geographical and cost requirements. And we always tread a fine line between the quality and the cost. We strive to make every penny of yours counts for the quality! Also, in today’s constantly changing and competitive environment of the electronics industry, there are always news products & services coming in to the market. We make ourselves constantly competitive by extending our service offerings for our clients, out most valuable partners!

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