|
|
Product & Technology - Capabilities - Rigid PCB |
 |
| |
| Layer count |
1~30layers |
| Laminates type |
FR-4(High Tg, Halogen Free, High Frequency)
FR-5, CEM-3, PTFE, BT, Getek,
Aluminium base
KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Board thickness |
6-240mil |
| Max Base copper weight |
140um (4oz) for inner layer
210um (6oz) for outer layer |
| Min mechanical drill size |
0.2mm (0.008")
|
| Aspect ratio |
12 : 1 |
| Max panel size |
508mm X 610mm (20" X 24") |
| Min line width/space |
0.1mm/0.1mm (0.004"/0.004") |
| Via hole type |
Blind/Burried/Plugged |
| HDI/Microvia |
YES |
| Surface finish |
HASL
Lead Free HASL
Immersion Gold (ENIG), Immersion Tin, Immersion Silver
Organic Solderability Preservative (OSP) / ENTEK
Flash Gold(Hard Gold plating)
Selective Gold Plating, Gold thickness up to 3um(120u")
Gold Finger, Carbon Print, Peelable S/M |
| Solder mask color |
Green, Blue, White, Black, Clear, etc. |
| Impedance |
Single trace or differential controlled ¡À10% |
| Outline finish type |
CNC Routing; V-Scoring/Cut; Punch |
| Tolerances |
Min Hole registration tolerance (NPTH) ¡À0.05mm
Min Hole registration tolerance (PTH)
¡À0.075mm
Min Pattern registration tolerance ¡À0.05mm
Min S/M registration tolerance (LPI) ¡À0.075mm
Board thickness (<1.0mm)
¡À0.1mm
Board thickness (>1.0mm) ¡À10%
Outline Routed
¡À0.1mm
Outline Scored ¡À0.2mm |
| Electrical Testing |
Voltage
10V
- 250V
Continuity 10
- 1000 Ohms |
|
