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Product&Technology

 
Product & Technology - Capabilities - Brief
 


1 to 30 layer Varies type of boards: Rigid, Flex, Rigid-flex PCBs
Integrated Monthly Capacity up to 1,500,000 sq.ft
Heavy Copper up to 210um(6oz)
Selective gold plating, gold thickness up to 3um(120u")
Lead free, RoHS compliant surface finish:
Leadfree HAL, OSP/ENTEK, Immersion Gold/Tin/SilverĄ­
Carbon Ink Printing
Peelable Mask
Blind & Buried Via holes
Laser Drilled Holes (HDI, Microvias)
Aluminium Substrate
Back Panel, Chip on Board for Wire Bonding

Units Conversion of U.S. CUSTOMAR and METRIC

1inch=1000mil=2.54cm=25.4mm
1mm=0.03937inch=39.37mil
1mil=0.0254mm
0.000 001meter=1um(micron)
0.000 001inch=1u"(micro inch)
1um=39.37u"
1um=0.03937mil
1oz=35um=14mil

Remarks:
quality inspection will subject to quality standard and customer specification,
capabilities list are for production capability reference only



 

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